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Qualification Tests For Plastics Package

#	Test	Abr.	Refer to MIL-STD 883 JEDEC-STD-22	Conditions Requirements	Duration	Sample Size per Lot (1)	Numberof Lots (1)	Accept on # fails	Comment
1	Preconditioning 3) subsequent	PC	JA113 J-STD-020	acc. MRT- level see Annex 5		77	3	0	RT
0	Temperature cycling 5) post test Bond pull test	TC BPS	M1010 JA104 AEC-Q100	-65°C / 150°C or -50°C / 150°C	500 cycl. 1000 cycl.	5	3	0	RT,HT
2	Preconditioning 3) subsequent	PC	JA113 J-STD-020	acc. to MRT- level see Annex 5		77	3	0	RT
0	Temperature Humidity Bias 4) post test Internal Inspection	THB	JA101	85°C / 85% R.H.4.) alternating VDDmax at all pins	1000 h	5	3	0	RT,HT
3	Preconditioning 3) subsequent	PC	JA113 J-STD-020	acc. to MRT- level see Annex 5		77	3	0	RT
0	Autoclave post test Internal Inspection	AC	JA102	121°C / 100% RH storage	240 h 2)	5	3	0	RT
4	High Temperature Bake	HTB	M1008 JA103	175°C, storage	500 h	77	3	0	RT,HT
5	High Temperature Operating Life Electrical Distribution	HTOL ED	M1005 JA108 AEC-Q100-009	150°C; or 125°C VDDmax; signal	500 h 1000 h	77	1	0	LT,RT,HT
6	Resistance to solvents	0	M2015	Isopropanol Turpentine solution DI water	0	12	3	0	not required for laser marked devices
7	Resistance to solder heat 6)	0	CECC 00802	bake : 24h 150°C humidity soak (acc. to MRT-level) 260°C; 10 sec 215°C; 40 sec	0	15 10 5	3	0	RT
8	Solderability	SD	M2003 JB102	8 h water vapour 245°C; 5s	0	15	3	0	0
9	Lead integrity	LI	JB105	0	0	5	1	0	not required for SMD
10	Physical Dimensions	PD	M2016 JB100	0	0	30	1	0	0
11	Internal Inspection Bond pull strength Bond shear	BPS BS	M2011 AEC-Q100-001	00	0	5	3	0	30 bonds from a min. of 5 devices